Process
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1. visual inspection of raw materials
Initial inspection of incoming raw materials, selected non-material impurities, and the general classification of raw materials
2. Type Classification
Model testing of raw materials.
3. resistivity sub-file
Measure the resistance of raw materials, raw materials after about measuring resistance classification.
4. cleaning materials
Put the ingredients soaked in hydrofluoric acid and nitric acid mixture to remove impurities in the surface oxide and other raw materials, and then rinse well with water.
5. drying
Will clean the raw materials into the drying oven.
6. packaging materials, into finished products
By raw material after drying, the resistance rate of packaging.
7. ingredients
According to production requirements, materials of different resistivity add the appropriate configuration to match the master alloy raw material for production requirements.
Monocrystalline silicon production process
1. silicon melt
And all the raw materials will be loaded into the quartz crucible, for taking the time to leak, and then under the protection of argon gas in the silicon melting temperature
2. stable silicon
Total fusion of the silicon material at high temperature to maintain a little time to cool down and then the appropriate period of time, for stability.
3. necking / seeding
Mentioned contact with the seed page, adjust to weld well, adjust the temperature started necking, necking and increased by a reasonable length of exclusion seed dislocation, the production target diameter crystal.
4. such as diameter growth
By controlling the pulling speed and melt temperature, so that the small dislocation-free crystals grew up to the target diameter by changing the pulling speed after the method of closing the shoulder, so that no dislocation diameter growth of crystals.
5. ending
Until the crystal growth to the appropriate time, in order to avoid anti-extension of the dislocation, the appropriate pulling speed and temperature changes gradually in diameter from the Analysis of the pages, so that no single-crystal complete dislocation.
6. annealing
Turn off the heating power, the appropriate upgrade crystal to finish annealing.
Wafer production process
1. Cut rounded side
The monocrystalline silicon rod according to size requirements, cut into silicon quasi-square bar, and the quasi-square bar after cutting corners, rounded by rolling mill.
2. pickling
Silicon will be tested and placed in quasi-square bar with a good acid, the out surface impurities, making it easy to plot the next process.
3. viscose
To clean the silicon quasi-square bar and the workpiece plate bonding.
4. slice
The sticky side sticks better standard silicon slicing machines installed in the cutting station, and by setting good parameters, be cut into pieces.
5. cleaning degumming
Will be pre-cut silicon wafers after cleaning to remove surface attachment of the cutting fluid and other impurities, and silicon wafers were pre-cleaned degumming.
6. ultrasonic cleaning
Will strip inserted in the silicon wafer through the box and placed in ultrasonic cleaning machine for cleaning.
7. drying
After the ultrasonic cleaning the wafer with box inserted in the drying machine drying station, through the centrifugal drying and heating to the surface.
8. chip packaging inspection
Testing of silicon. Including appearance, thickness, resistivity, TTV and Warp, etc., and post-test wafer shipments by grade and type of classification and packaging